In the “Post Moore’s Law Era”, advancements in computer systems have been enabled by a wide range of hardware/software features. This talk will focus on ‘advanced’ packaging and Si integration features such as 3D chip stacking. Understanding these new capabilities will be pivotal towards building future systems. This talk will survey both deployed systems and publicly available technology roadmaps.

Bio:

Dr Stuecheli has been working in Austin since the late 90s after completing my undergrad at UT. He spent 25 years at IBM working on the Power line of high end servers. His initial role was DV on the Power4 product, but transitioned into performance centric architecture work for the Power6 “nest” (caches, coherence, prefetch, NoC, memory, etc). Recognizing the role of the overall system in building optimized designs, his scope gradually expanded. In his later years, IBM attempted to grow beyond proprietary design through collaboration with companies like Nvidia and Google in the Open Power project. Dr Stuecheli then joined Nvidia, Google, and Tenstorrent for relatively short tenures. He currently works for Arm. His current focus is the development of architectural features to enable overall system optimization.

While at IBM he completed graduate work at UT under Dr Lizy John, and remains active through participation on the PC of various conferences (this year ISCA, MICRO, and HPCA).