Are you excited by the idea of designing the processors and chips that power the world's most advanced mobile and AI technologies? Join Qualcomm for an exclusive Tech Talk featuring hiring managers and mentors from our DSP Architecture and ASICS Engineering teams.

Who Should Attend:

• Bachelor's (Juniors), Master's, or PhD students
• Majors in Computer Engineering, Electrical Engineering, or related disciplines
• Preferred graduation dates: December 2026 - June 2027

What You'll Discover

• How Qualcomm's DSP Core Design team architects high-performance processors for mobile, AI, and embedded systems.
• How our ASIC Engineering teams implement these designs into silicon, driving innovation in performance, power efficiency, and scalability.
• How the DSP Core Implementation team collaborates with ASIC engineers to transform architecture into world-class chips through advanced design and verification flows.
• The real-world impact of these combined DSP and ASIC innovations in smartphones, automotive platforms, and IoT devices.
• Internship opportunities for Summer 2026 across both DSP and ASIC Engineering—and insider tips on how to stand out as a candidate.

Why You Should Attend:

• Connect directly with Qualcomm engineers and decision-makers.
• Learn about exciting project and technologies you could work on.
• Get insider tips on the intern application process and technical interview prep.

Whether you're curious about processor architecture or passionate about silicon design, this is your chance to explore how our skills can contribute to Qualcomm's mission of inventing the tech the world loves.