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Fast Solvers for Electromagnetics and Multiphysics-Based Analysis and Design of Integrated Circuits and Systems

ECE General Seminars Seminar

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Location: EER 3.646
Speaker:
Dan Jiao
Purdue University

Abstract

The design of advanced integrated circuits and microsystems, from zero frequency to light, calls for fast and accurate electromagnetics-based modeling and simulation. The move towards higher frequencies and heterogeneous integration emphasizes this need even more. However, the analysis and design of integrated circuits and microsystems present many unique challenges to electromagnetic (EM) analysis, such as exponentially increased problem size, extremely multiscale systems spanning from nano- to centimeter scales, the interacting physics of circuits, EM, thermodynamics, mechanics, and more. 

In this talk, I will present two recent advances in fast solvers to tackle these challenges. One advancement is fast direct solvers of linear (optimal) complexity, in contrast to conventional cubic complexity. It addresses the problem size challenge by directly inverting or factorizing the dense or sparse system matrix resulting from either integral-equation- or partial-differential-equation-based 3-D EM analysis in low complexity with controlled accuracy. Another advancement is a new class of explicit and unconditionally stable time methods to address the multiscale challenge, retaining the matrix-free merit of an explicit method while overcoming the shortcoming related to the time step’s dependence on the space step. The application of these fast solvers to full-chip and complete-package design problems will be demonstrated. Additionally, the fast solver technology has been fused with advanced ML techniques for multiscale and multiphysics modelling, analysis, and design of 3-D heterogeneously integrated systems.


Bio

Dan Jiao received her Ph.D. in electrical engineering from the Electromagnetics Lab at the University of Illinois at Urbana-Champaign, in 2001. She then worked at the Technology Computer-Aided Design (CAD) Division, Intel Corporation until September 2005, as a Senior CAD Engineer, Staff Engineer, and Senior Staff Engineer. In September 2005, she joined Purdue University as an Assistant Professor with the School of Electrical and Computer Engineering, where she became a tenured Associate Professor in 2009, a Full Professor in 2013, and holds the title of Synopsys Professor since 2022. She is the Director of Rapid-HI (Heterogeneous Integration) Design Institute, an Elmore ECE Emerging Frontiers Center. She also serves as the Co-Director of the Consortium on Electromagnetics Technology at Purdue.


A Fellow of the IEEE and a Distinguished Microwave Lecturer of the IEEE MTT Society, Jiao has authored over 350 papers in refereed journals and international conferences. Her current research interests include computational electromagnetics, applied electromagnetics, computational multiphysics, high-frequency integrated circuit design and analysis, heterogeneous integration, and advanced packaging. Prof. Jiao’s research recognitions include the Computational Electromagnetics Award of the ACES society in 2022, the Intel’s Outstanding Researcher Award in 2019, the Sergei A. Schelkunoff Prize Paper Award of the IEEE Antennas and Propagation Society in 2013, being one of the 85 selected for National Academy of Engineering’s (NAE) 2011 U.S. Frontiers of Engineering Symposium, the NSF CAREER Award in 2008, the Intel Logic Technology Development (LTD) Divisional Achievement Award in 2003, the 2000 Raj Mittra Outstanding Research Award, and numerous Best Paper Awards and Best Paper Finalists from conferences. She has served as an Associate Editor for the IEEE Trans. on Microwave Theory and Techniques, IEEE Trans. on Components, Packaging, and Manufacturing Technology, and IEEE Trans. Signal and Power Integrity. She has been appointed as the incoming Editor-in-Chief of the IEEE Journal on Multiscale and Multiphysics Computational Techniques.
 

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